disco hi tec america inc is a , and company. This page shows the major manufacturers of DISCO HI TEC AMERICA INC. Results are limited to 15 suppliers, if you want to see more suppliers visit the manufacturers page of DISCO HI TEC AMERICA INC.
3270 scott boulevard santa clara ca 95054-3011
POLYSTYRENE
2024-12-12 |
1 CAS |
165KG |
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
HS 846410 |
2024-12-10 |
1 PKG |
684KG |
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
HS 846410 |
2024-11-07 |
3 PKG |
1319KG |
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
HS 846410 |
2024-11-07 |
5 PKG |
1555KG |
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
HS 846410 |
2024-10-04 |
5 CTN |
3979KG |
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
HS 846410 |
2024-10-04 |
1 PKG |
678KG |
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
HS 846410 |
2024-10-03 |
6 PKG |
1860KG |
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
HS 846410 |
2024-08-30 |
3 PKG |
1048KG |
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
HS 846410 |
2024-08-30 |
3 PKG |
1048KG |
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
HS 846410 |
2024-08-30 |
3 PKG |
1048KG |
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
HS 846410 |
2024-07-13 |
3 PKG |
4037KG |
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
HS 846410 |
2024-07-13 |
3 PKG |
4037KG |
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
HS 846410 |
2024-07-07 |
2 PKG |
2593KG |
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
HS 846410 |
2024-07-07 |
2 PKG |
2593KG |
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
HS 846410 |
2024-06-14 |
2 PKG |
1975KG |
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
HS 846410 |
2024-06-14 |
2 PKG |
1975KG |
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
HS 846410 |
2024-05-22 |
6 PKG |
5546KG |
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
HS 846410 |
2024-05-22 |
6 PKG |
5546KG |
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
HS 846410 |
2024-04-22 |
1 PKG |
1285KG |
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
HS 846410 |
2024-04-22 |
1 PKG |
1285KG |
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
HS 846410 |
2024-03-16 |
10 CTN |
11645KG |
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICEMACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
HS 846410 |
2024-02-06 |
1 CTN |
2240KG |
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
HS 846410 |
2024-02-06 |
1 CTN |
2240KG |
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
HS 846410 |
2024-01-03 |
1 PKG |
597KG |
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
HS 846410 |
2023-11-19 |
3 CTN |
1955KG |
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
HS 846410 |
2023-11-09 |
9 PKG |
5090KG |
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICEMACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
HS 846410 |
2023-10-19 |
3 CTN |
1070KG |
MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICE |
HS 846410 |
2023-08-18 |
1 PKG |
687KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE ICES, ELECTRONIC INTEGRATED CIRCUITS |
HS 854290 |
2023-08-08 |
1 CTN |
1277KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE ICES, ELECTRONIC INTEGRATED CIRCUITS |
HS 854290 |
2023-08-01 |
2 PKG |
1336KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE ICES, ELECTRONIC INTEGRATED CIRCUITS |
HS 854290 |
2023-07-27 |
6 PKG |
2077KG |
MACHINE PARTS |
HS 851590 |
2023-07-06 |
2 PKG |
660KG |
POLYSTYRENE |
HS 390311 |
2023-06-09 |
5 PKG |
1535KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE |
HS 903141 |
2023-05-05 |
2 CTN |
2250KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE |
HS 903141 |
2023-05-05 |
5 PKG |
1545KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE |
HS 903141 |
2023-04-07 |
5 PKG |
1540KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE |
HS 903141 |
2023-03-31 |
1 CAS |
278KG |
POWER LIFTER |
HS 852010 |
2023-03-24 |
14 PKG |
13407KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEMACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE |
HS 903141 |
2023-03-17 |
5 PKG |
1555KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE |
HS 903141 |
2023-03-09 |
4 PKG |
7025KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE |
HS 903141 |
2023-01-30 |
4 CTN |
1070KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
HS 847989 |
2022-12-22 |
5 CTN |
1480KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
HS 847989 |
2022-12-22 |
5 CTN |
1480KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
HS 847989 |
2022-12-06 |
1 CTN |
526KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
HS 847989 |
2022-11-09 |
1 PKG |
2285KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE |
HS 903141 |
2022-11-09 |
1 PKG |
2285KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE |
HS 903141 |
2022-10-18 |
1 PKG |
518KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE |
HS 903141 |
2022-10-18 |
1 PKG |
518KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE |
HS 903141 |
2022-09-20 |
1 CTN |
681KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
HS 847989 |
2022-09-05 |
3 CTN |
1067KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE |
HS 903141 |
2022-08-31 |
3 CTN |
1370KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
HS 847989 |
2022-08-31 |
1 CTN |
516KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
HS 847989 |
2022-08-31 |
3 CTN |
1370KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
HS 847989 |
2022-08-31 |
1 CTN |
516KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
HS 847989 |
2022-08-18 |
1 CAS |
274KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
HS 847989 |
2022-08-17 |
1 CTN |
518KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
HS 847989 |
2022-08-17 |
1 CTN |
518KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
HS 847989 |
2022-08-09 |
2 CTN |
1386KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
HS 847989 |
2022-07-15 |
1 CTN |
129KG |
POLYSTYRENE |
HS 390311 |
2022-07-15 |
1 CTN |
129KG |
POLYSTYRENE |
HS 390311 |
2022-06-23 |
3 PKG |
1875KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE |
HS 903141 |
2022-06-23 |
3 PKG |
1875KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE |
HS 903141 |
2022-06-23 |
3 PKG |
1875KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE |
HS 903141 |
2022-06-17 |
1 PKG |
127KG |
POLYSTYRENE |
HS 390311 |
2022-06-17 |
1 PKG |
127KG |
POLYSTYRENE |
HS 390311 |
2022-06-17 |
1 PKG |
127KG |
POLYSTYRENE |
HS 390311 |
2022-06-09 |
1 CTN |
1287KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
HS 847989 |
2022-06-09 |
2 CTN |
1352KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
HS 847989 |
2022-03-23 |
1 CTN |
675KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
HS 847989 |
2022-03-23 |
1 CTN |
675KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
HS 847989 |
2022-03-23 |
1 CTN |
675KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
HS 847989 |
2022-01-20 |
1 CTN |
1282KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
HS 847989 |
2022-01-20 |
1 CTN |
1282KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
HS 847989 |
2022-01-20 |
1 CTN |
1282KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
HS 847989 |
2021-11-22 |
1 SKD |
525KG |
AUTOMATIC DICING SAW . . . . . . . . |
HS 820299 |
2021-11-12 |
1 CTN |
523KG |
AUTOMATIC DICING SAW HS CODE 8486.20 |
HS 848620 |
2021-10-27 |
2 CTN |
630KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
HS 847989 |
2021-10-04 |
6 PKG |
4433KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE |
HS 903141 |
2021-09-01 |
3 CTN |
1000KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
HS 847989 |
2021-07-26 |
4 CTN |
1261KG |
AUTOMATIC DICING SAW MODEL NO. DAD3221 SERIAL NO. TK1524, TK1525 2 UNITS . AUTOMATIC CLEANING SYSTEM MODEL NO. DCS1440 SERIAL NO. LD5179 1 UNIT |
HS 490191 |
2021-07-07 |
2 CTN |
1725KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
HS 847989 |
2021-06-15 |
3 PKG |
1625KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
HS 847989 |
2021-06-13 |
11 CTN |
5703KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE |
HS 903141 |
2021-05-19 |
3 CTN |
1506KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
HS 847989 |
2021-05-19 |
3 CTN |
1506KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
HS 847989 |
2021-05-18 |
8 PKG |
6275KG |
FULLY AUTOMATIC DICING SAW . . . . . . . . . |
HS 851521 |
2021-04-04 |
1 CAS |
854KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
HS 847989 |
2021-03-27 |
2 CTN |
1317KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
HS 847989 |
2021-03-27 |
2 CTN |
1317KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
HS 847989 |
2021-03-15 |
1 CTN |
1291KG |
AUTOMATIC DICING SAW MODEL NO.DAD3350 SERIAL NO.KB7076 1 UNIT . . . . . |
HS 490191 |
2021-03-06 |
3 CTN |
1501KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
HS 847989 |
2021-03-06 |
2 CTN |
1318KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
HS 847989 |
2021-02-15 |
1 CTN |
512KG |
MINI-SYSTEMS, INC PO#23368 N W: KGS G W: KGS DIMS.: X X CM SERIAL NO. TK1493 C NO.1 USA |
HS 902230 |
2021-02-05 |
10 CTN |
13107KG |
MACHINES FOR MANUFACTURE OF BOULES OR WAFERSMACHINES FOR MANUFACTURE OF BOULES OR WAFERS |
HS 846410 |
2021-02-05 |
10 CTN |
13107KG |
MACHINES FOR MANUFACTURE OF BOULES OR WAFERSMACHINES FOR MANUFACTURE OF BOULES OR WAFERS |
HS 846410 |
2021-01-07 |
1 CTN |
518KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
HS 847989 |
2020-12-14 |
3 CTN |
1106KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
HS 847989 |
2020-11-23 |
2 CTN |
2285KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE |
HS 903141 |
2020-11-23 |
2 CTN |
1389KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
HS 847989 |
2020-11-23 |
2 CTN |
2285KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE |
HS 903141 |
2020-11-23 |
2 CTN |
1389KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
HS 847989 |
2020-09-30 |
1 CTN |
1284KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE |
HS 903141 |
2020-07-09 |
3 CTN |
1880KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE |
HS 903141 |
2020-06-30 |
2 PKG |
547KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE |
HS 903141 |
2020-06-23 |
2 CTN |
1328KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE |
HS 903141 |
2020-06-19 |
3 CTN |
2000KG |
AUTOMATIC SURFACE GRINDER MODEL NO. DAG810 SERIAL NO. JU1515 1 UNIT . . . . . . . . . . . |
HS 490191 |
2020-06-12 |
1 CTN |
514KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE |
HS 903141 |
2020-05-13 |
2 CTN |
1302KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE |
HS 903141 |
2020-05-03 |
1 CTN |
656KG |
AUTOMATIC DICING SAW MODEL NO. DFD3240 SERIAL NO. PE2115, . . . . . . |
HS 490191 |
2020-04-19 |
4 CTN |
1510KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE |
HS 903141 |
2020-02-25 |
1 CTN |
1KG |
LITHIUM BATTERIES |
HS 850650 |
2020-02-14 |
1 CTN |
512KG |
AUTOMATIC DICING SAW MODEL NO.DAD3221 SERIAL NO.TK2001 , 1 UNIT . . . . |
HS 490191 |
2020-02-11 |
3 CTN |
1290KG |
MACHINE TOOLS FOR DEBURRING, POLISHING METAL |
HS 846090 |
2020-02-11 |
2 PKG |
771KG |
MACHINE TOOLS FOR DEBURRING, POLISHING METAL |
HS 846090 |
2020-01-22 |
6 CTN |
1901KG |
MACHINE TOOLS FOR DEBURRING, POLISHING METAL |
HS 846090 |
2020-01-07 |
10 PKG |
7995KG |
MACHINE TOOLS FOR DEBURRING, POLISHING METAL |
HS 846090 |
2019-12-10 |
1 CTN |
2KG |
LITHIUM BATTERIES |
HS 850650 |
2019-11-19 |
4 CTN |
1925KG |
MACHINE TOOLS FOR DEBURRING, POLISHING METAL |
HS 846090 |
2019-11-05 |
1 CTN |
1298KG |
MACHINE TOOLS FOR DEBURRING, POLISHING METAL |
HS 846090 |
2019-10-31 |
4 CTN |
1097KG |
MACHINE TOOLS FOR DEBURRING, POLISHING METAL |
HS 846090 |
2019-09-24 |
3 CTN |
2040KG |
MACHINE TOOLS FOR DEBURRING, POLISHING METAL |
HS 846090 |
2019-07-30 |
1 CTN |
12KG |
LITHIUM BATTERIES |
HS 850650 |
2019-05-10 |
2 CTN |
1700KG |
AUTOMATIC SURFACE GRINDER MODEL NO. DAG810 SERIAL NO. JU1467, . . . . . . |
HS 490191 |
2019-04-30 |
6 PKG |
4895KG |
FULLY AUTOMATIC IN-FEED . . . . . . . |
HS 851521 |
2019-04-24 |
6 PKG |
4895KG |
FULLY AUTOMATIC IN-FEED . . . . . . . |
HS 851521 |
2019-04-18 |
2 CTN |
1281KG |
FULLY AUTOMATIC DICING SAW MODEL NO. DAD3260 SERIAL NO. PV2035 1 UNIT . . . . |
HS 851521 |
2019-04-18 |
2 CTN |
1725KG |
AUTOMATIC SURFACE GRINDER MODEL NO. DAG810 SERIAL NO. JU1478, 1 UNIT . . . . |
HS 490191 |
2019-04-04 |
4 CTN |
1355KG |
FULLY AUTOMATIC DICING SAW MODEL NO. DAD3240 SERIAL NO. PE2099, PE2100, 2 UNITS . . . . |
HS 851521 |
2019-04-03 |
2 CTN |
213KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DE |
HS 903141 |
2019-03-20 |
4 CTN |
1795KG |
FULLY AUTOMATIC DICING SAW MODEL NO. DFD6341 SERIAL NO. JWA740, 1 UNIT . . . . . . . . . . . |
HS 851521 |
2019-01-29 |
1 CTN |
4KG |
MACHINES FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS |
HS 847989 |
2019-01-11 |
3 CTN |
577KG |
DISCO WATER RECYCLING UNIT MODEL NO. DWR1722 SERIAL NO. KK3037, 1 UNIT . . . . |
HS 490191 |
2016-10-06 |
1 CTN |
89KG |
CUT-OFF WHEEL HS CODE : 6804.22 |
HS 680422 |
2016-09-22 |
3 CTN |
889KG |
CUT-OFF WHEEL HS CODE : 6804.22 |
HS 680422 |
2016-09-15 |
3 PCS |
606KG |
DISCO WATER RECYCLING UNIT (8486.40) |
HS 840220 |
2016-07-20 |
1 CTN |
172KG |
CUT-OFF WHEEL HS CODE:6804.22 |
HS 680422 |
2016-06-16 |
1850 PCS |
512KG |
CUT-OFF WHEEL MADE IN JAPAN HS CODE:6804.22 |
HS 680422 |
2016-06-12 |
3 CAS |
1964KG |
AUTOMATIC DICING SAW (8486.20) |
HS 820299 |
2016-06-08 |
3 CTN |
1365KG |
AUTOMATIC DICING SAW (8486.20) |
HS 820299 |
2016-05-18 |
3 CAS |
1331KG |
AUTOMATIC DICING SAW(8486.20) |
HS 820299 |
2016-04-24 |
3 PKG |
698KG |
AUTOMATIC DICING SAW HS CODE:8486.20 |
HS 848620 |
2016-03-31 |
4360 PKG |
307KG |
CUT-OFF WHEEL HS CODE:6804.22 |
HS 680422 |
2016-02-23 |
13 PCS |
692KG |
AUTOMATIC DICING SAW (8486.20) |
HS 820299 |
2016-02-17 |
200 PCS |
57KG |
CUT-OFF WHEEL H.S.CODE : 6804.22 |
HS 680422 |
2016-02-11 |
3 PCS |
2309KG |
FULLY AUTOMATIC DICING SAW (8486.20) |
HS 851521 |
2016-01-07 |
1500 PKG |
279KG |
CUT-OFF WHEEL H.S.CODE : 6804.22 |
HS 680422 |
2015-12-21 |
2 CTN |
680KG |
AUTOMATIC DICING SAW (8486.20) |
HS 820299 |
2015-12-16 |
2 CTN |
693KG |
AUTOMATIC DICING SAW (8486.10) |
HS 847130 |
2015-11-27 |
8 CTN |
2050KG |
AUTOMATIC DICING SAW (8486.10) |
HS 847130 |
2015-11-22 |
2 CTN |
257KG |
AUTOMATIC DICING SAW HS CODE:8486.20 |
HS 848620 |
2015-11-16 |
3 CTN |
1762KG |
FULLY AUTOMATIC DICING SAW (8486.20) |
HS 851521 |
2015-11-11 |
1 CTN |
35KG |
CUT-OFF WHEEL H.S.CODE : 6804.22 |
HS 680422 |
2015-11-05 |
6 CTN |
83KG |
CUT-OFF WHEEL H.S.CODE : 6804.22 |
HS 680422 |
2015-11-04 |
2 CAS |
221KG |
AUTOMATIC CLEANING SYSTEM |
HS 847149 |
2015-10-12 |
3 CAS |
2122KG |
AUTOMATIC SURFACE GRINDER (8486.10) |
HS 847130 |
2015-09-17 |
1 CAS |
364KG |
CUT-OFF WHEEL H.S.CODE : 6804.22 |
HS 680422 |
2015-09-06 |
5 CAS |
1406KG |
AUTOMATIC DICING SAW HS CODE : 8486.20 |
HS 848620 |
2015-08-24 |
4 CAS |
4342KG |
FULLY AUTOMATIC IN-FEED SURFACE GRINDER (8486.10) |
HS 845011 |
2015-07-30 |
6 CAS |
2686KG |
AUTOMATIC DICING SAW (8486.10) |
HS 847130 |
2015-07-30 |
6 CAS |
2694KG |
AUTOMATIC DICING SAW (8486.10) |
HS 847130 |
2015-07-02 |
1 CAS |
191KG |
CUT-OFF WHEEL H.S.CODE : 6804.22 |
HS 680422 |
2015-05-31 |
6 CAS |
2820KG |
AUTOMATIC DICING SAW HS CODE : 8486.20 |
HS 848620 |
2015-05-31 |
2 CAS |
721KG |
AUTOMATIC DICING SAW HS CODE : 8486.20 |
HS 848620 |
2015-05-02 |
2 CAS |
722KG |
AUTOMATIC DICING SAW MODEL NO. DAD3240 SERIAL NO. PE1285 1 UNIT HS CODE : 8486.20 . . . . . |
HS 848620 |
2014-12-07 |
3 CAS |
143KG |
CUT-OFF WHEEL HS CODE : 6804.22 |
HS 680422 |
2014-11-19 |
4 CAS |
805KG |
DISCO WATER RECYCLING UNIT . . . . . . . . |
HS 840220 |
2014-11-05 |
3 CAS |
1851KG |
FULLY AUTOMATIC DICING SAW . . . . . . . . |
HS 851521 |
2014-08-29 |
4 CAS |
2120KG |
AUTOMATIC SURFACE GRINDER MODEL NO. DAG810 SERIAL NO. JU1268 1 UNIT . H.S. NO. 848610 . |
HS 848610 |
2014-08-27 |
4 CAS |
190KG |
CUT-OFF WHEEL HS CODE : 6804.22 |
HS 680422 |
2014-07-09 |
2 CAS |
684KG |
AUTOMATIC DICING SAW . . . . . . . . |
HS 820299 |
2014-06-21 |
2 CAS |
718KG |
AUTOMATIC DICING SAW MODEL NO. DAD3240 SERIAL NO. PE1228 . . . . . . |
HS 490191 |
2014-06-11 |
3 CAS |
1364KG |
AUTOMATIC DICING SAW . . . . . . . . |
HS 820299 |
2014-05-21 |
9 PKG |
3554KG |
AUTOMATIC SURFACE GRINDER . . . . . . . . . . |
HS 847690 |
2014-02-09 |
3 CAS |
1409KG |
AUTOMATIC DICING SAW 3 CASE |
HS 820299 |
2014-02-09 |
3 CAS |
1404KG |
AUTOMATIC DICING SAW 3 CASES |
HS 820299 |
2014-02-05 |
16 CTN |
190KG |
CUT-OFF WHEEL HS CODE : 6804.22 |
HS 680422 |
2014-01-19 |
3 CAS |
1412KG |
AUTOMATIC DICING SAW . . . . . . . . . |
HS 820299 |
Imports in 2021 |
---|
![]() |
![]() |
![]() |
disco corp support from japan. Their major products are POLYSTYRENE . disco hi tec america inc gets its POLYSTYRENE from disco corp.
Between 2014 and 2017, disco hi tec america inc ordered 22 shipments from disco corp.
In 2014, disco hi tec america inc made up 56% of disco corp's sales to USA. This number went to 69% by 2015 and 60% in 2016. In 2017, disco hi tec america inc made up 0% of disco corp’s sales to USA
1.POLYSTYRENE
1.POLYSTYRENE
2014 | 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
---|---|---|---|---|---|---|---|---|---|---|---|
13 | 18 | 14 | 0 | 0 | 16 | 20 | 22 | 33 | 17 | 24 | 0 |